? Transmission
? Off-axis
? 3D SART
The X3 is an automatic X-ray inspection system featuring combined Transmission and 3D-Technology for sophisticated high-speed inspection in electronic production. The system is based on the motion concept of the MatriX X2.5 AXI system. A newly developed 3D reconstruction software generates slice images for 3D analysis of solder joints. Main applications are double-sided boards with critical overlapping areas.
X-ray System Features
High Speed Inline AXI system
Maintenance free sealed X-ray tube and digital detector technology
5-axes programmable motion system with linear drive sample table for high speed inspection mode
Inline board handling with automatic width adjust
Automatic grey-level and geometrical calibration
Barcode scanner (1D/2D) for serial number and product type selection
APPLICATIONS
ELECTRONIC COMPONENTS AND SOLDER-JOINTS
A unique advanced algorithm library is available for electronic applications specifically for component and solder-joint inspection on PCB, hybrid or chip level assembly processes
? All standard SMDs and THT/PTH components
? Specific BGA and QFN algorithm
? Off-axis image analysis for BGA Head-in-pillow or THT/PTH Barrel Fill measurement
? Cooling plates/heatsink void inspection
ALGEBRAIC 3D RECONSTRUCTION
The newly developed algebraic reconstruction algorithm for 3D analysis is the highlight of the inline 3D system X3. It requires only few projections for generation of detailed, high resolution slice images. In addition the algorithm is independent of geometries and therefore offers optimum flexibility with respect to the acquisition setup.
SPECIFICATIONS
Physical Dimension
Dimensions： 1535 mm (H) x 1800 mm (W) x 1572 mm (D)
Feet adjusted, so conveyor height is： 950 mm (SMEMA)
Weight： 3500 kg
Safe Operating Temperature： 15° - 32 °C
Power Consumption： max. 6 kW
Line Voltage： 400 VAC, 50/60 Hz 3 phase, 16 A，208 VAC, 50/60 Hz 3 phase, 25 A
Air： 5-7 Bar, < 2 l/min, filtered (30μ), dry, oil free
Motion System
High-speed sample table with linear drives (X,Y)
Driving distance X,Y： 510 x 405 mm
Position Repeatability： +/- 5 μm
X-Ray tube (Z)： 0 - 150 mm
Detector Axes (U,V)： 220 x 200 mm
X-ray Source (sealed tube)
Energy： 130 kV/40 W
Focal Spot Size： 5 - 7 microns
X-Ray Tube Orientation： End window tube
Digital Image Detector
Grey value resolution： 14 bit
Video output： Camera link interface
Detector Type A： CMOS Detector (1,5k x 1,5k)
Active inspection area： 115 x 115 mm
Detector Type B： CMOS Detector (2k x 2k)
Active inspection area： 48 x 48 mm
Image Performance
Angle shot capability： 0 – 45 dgr
(A) Standard FOV high-speed setup
Transmission FoV ： 0.4” (10 mm) to 2.0” (50 mm)
Object resolution (@min. FOV)： 8-10 μm
(B) high-resolution setup
Transmission FoV： 0.4” (10 mm) to 1.2” (30 mm)
Object resolution (@min. FOV)： 3-5 μm
Sample Inspection Parameter
Max. board size (X)x(Y)： 18”(460 mm) x 14”(360 mm)
Min. board size (X)x(Y)： 100 mm x 80 mm
Max. inspection area (X)x(Y)： 460 mm x 360 mm
Max board weight:： 2,5 kg
Board thickness： 0,8 – 5 mm
Assembly Clearance
Topside (incl. board thickness)： 30 mm
Bottom side (excl. board thickness)： 30 mm
Edge clearance for clamping： 3 mm
Safety / Regulatory
Full safe, interlocked enclosure. Complies with all U.S. and International standards for cabinet radiography systems. CDRH directives / CE compliant.
